Metal Production Strategy LLC (MPS) is a full line metal service center specializing in the rare, exotic, and hard to find materials used in aerospace, marine, military and industrial applications. With an experienced staff sharing decades of knowledge in the industry and a high level of quality assurance supporting U.S. Military and International standards, Metal Production Strategy LLC works hard to provide our customers the best metal materials with the proper documentation, production
and packaging.
Tom Trexler
President
Metal Production Strategy LLC
240-271-6940
Welcome to Research Metal Industries Inc.
Founded in 2020, MPS. strives to build customer relationships, create an open line of communication for project support, and to meet the needs of our industry and customers. We apply the very latest tools and techniques to create exceptional results. Our team consists of experienced, and highly motivated members that allow us to provide quality and consistent support. The integrity that MPS. brings to its customers is based on the care, experience and talents of our management staff.
What we offer
MPS provides services and products for aerospace, aircraft, missile and commercial industries. Services include prototypes and tooling as well as long production runs, all made to exact specifications and requirements.
We solicit your inquiries on the following:
• Aircraft Quality Metal Spinning
• CNC Lathe and Milling
• Deep Draw
• Grinding
• Tube Bending
• Water Jet Cutting
• Wire EDM Production
• Assembly
• Customized Projects
• NADCAP Accredited Welding
Additional Services
Cut to Length
Saw Cutting
Laser Cutting
Plasma Cutting
Metal Testing
Export Packing
Cushion Packing
UPS/Fed Ex Packing
Ultrasonic Testing
Special MarkingTag Identification
Laser/Chem Etching
Water Jet Services
Grinding Services
Sheet Shearing
Conversion Services
Heat Treatment
Galvanizing
Pickling
Painting
Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors. ALD is a key process in fabricating semiconductor devices, and part of the set of tools for synthesising nanomaterials.
As a permeation barrier for plastics
ALD can be used as a permeation barrier for plastics. For example, it is well established as a method for encapsulation of OLEDs on plastic.] ALD can also be used to inoculate 3-D printed plastic parts for use in vacuum environments by mitigating outgassing, which allows for custom low-cost tools for both semiconductor processing and space applications. ALD can be used to form a barrier on plastics in roll to roll processes.
Quality and its control
The quality of an ALD process can be monitored using several different imaging techniques to make sure that the ALD process is occurring smoothly and producing a conformal layer over a surface. One option is the use of cross-sectional scanning electron microscopy (SEM) or transmission electron microscopy (TEM). High magnification of images is pertinent for assessing the quality of an ALD layer. X-ray reflectivity (XRR) is a technique that measures thin-film properties including thickness, density, and surface roughness. Another optical quality evaluation tool is spectroscopic ellipsometry. Its application between the depositions of each layer by ALD provides information on the growth rate and material characteristics of the film.
Applying this analysis tool during the ALD process, sometimes referred to as in situ spectroscopic ellipsometry, allows for greater control over the growth rate of the films during the ALD process. This type of quality control occurs during the ALD process rather than assessing the films afterwards as in TEM imaging, or XRR. Additionally, Rutherford backscattering spectroscopy (RBS), X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), and four-terminal sensing can be used to provide quality control information with regards to thin films deposited by ALD.
Advantages and limitations
Advantages
ALD provides a very controlled method to produce a film to an atomically specified thickness. Also, the growth of different multilayer structures is straightforward. Because of the sensitivity and precision of the equipment, it is very beneficial to those in the field of microelectronics and nanotechnology in producing small, but efficient semiconductors. ALD typically involves the use of relatively low temperatures and a catalyst, which is thermochemically favored. The lower temperature is beneficial when working with soft substrates, such as organic and biological samples. Some precursors that are thermally unstable still may be used so long as their decomposition rate is relatively slow.
Disadvantages
High purity of the substrates is very important, and as such, high costs will ensue. Although this cost may not be much relative to the cost of the equipment needed, one may need to run several trials before finding conditions that favor their desired product. Once the layer has been made and the process is complete, there may be a requirement of needing to remove excess precursors from the final product. In some final products there are less than 1% of impurities present.
Economic viability
Atomic layer deposition instruments can range anywhere from $200,000 to $1,800,000 based on the quality and efficiency of the instrument. There is no set cost for running a cycle of these instruments; the cost varies depending on the quality and purity of the substrates used, as well as the temperature and time of machine operation. Some substrates are less available than others and require special conditions, as some are very sensitive to oxygen and may then increase the rate of decomposition. Multicomponent oxides and certain metals traditionally needed in the microelectronics industry are generally not cost efficient.